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mfn1106ms - tr narrow distribution angle with dome lens , ired peak w avelength : 945nm outer dimension 3.8 x 3.8 x 2.1mm ( l x w x h ) standard p roduct r eference s heet features package recommended a pplications page : 1 product features ? automotive use (adas: a dvanced driver assistance system), driver monitoring system, light source for parking assist system camera) etc. ? other use (tof (time of flight) sensor, security equipment) etc. ? operating temperature : - 40 to +125 deg. ? radiant intensity : 230mw/ sr (typ.) @ i f = 1a ? lead C free soldering compatible ? rohs compliant 2017.4.25
mfn1106ms - tr cu pattern solder resist anode cathode top v iew side view bottom view cathode mark outline d imensions unit mm weight 38.0mg tolerance 0.1 recommended p ad page : 2 unit mm tolerance 0.1 solder stencil apertural area 2017.6.30 4 - r0 . 2 no. part name materials qty. led die algaas 1 encapsulant silicone resin - substrate ceramic 1 terminal au plating anode : 2 cathode : 1
mfn1106ms - tr specifications page : 3 2017.4.25 item symbol maximum ratings units product overview die material algaas resin color water clear absolute maximum ratings operating temperature t opr - 40 +125 storage temperature t stg - 40 +125 note 1 note 1 junction temperature tj 125 forward current i f 1 a peak temperature of reflow soldering t sld 260 reverse voltage v r 5 v electrostatic discharge threshold "hbm" (ta=25 ) v esd 2 kv pulse forward current(tw Q 100sec, duty Q 1%) i frm 5 a note 2 note 1 esd testing method : eiaj4701/300(304) human body model (hbm) 1.5k, 100pf note 2 the ranges of operating and storage temperature are not applied to taping condition. 5.0 max. 7.0 thermal resistance(junction - soldering point) r th(j-s) /w (ta=25 ) item symbol units thermal characteristics typ.
mfn1106ms - tr specifications page : 4 2017.7.18 terminal capacitance c t v = 0v f = 1mhz - 215 - pf note 3 this product is classified "exempt" according to "photobiological safety of lamps and lamp systems: iec62471". v reverse current i r v r = 5v - - 5 a forward voltage v f i f = 1a 1.1 1.5 2.1 deg. response time t r / t f i f = 1a r l = 50 - 15 - ns half intensity angle 2 1/2 - 120 - nm spectral bandwidth at 50% of i max ? i f = 1a - 45 - nm peak wavelength p i f = 1a 925 945 965 total radiant flux e i f = 1a - 950 - mw units radiant intensity i e i f = 1a 140 230 300 mw/sr item symbol conditions min. typ. max. note 3 electro-optical characteristics (ta=25 ) max. min. 300 200 140 200 b a rank radiant intensity(mw/sr) conditions i f =1a ta=25 notes measurement tolerance: 7% sorting chart for radiant intensity leds shall be sorted out "radiant intensity" into the following chart and each rank parts shall be packed separately when shipping. rank forward voltage(v) conditions min. max. a 1.1 sorting chart for forward voltage notes measurement tolerance: 0.1v leds shall be sorted out "forward voltage" into the following chart and each rank parts shall be packed separately when shipping. 1.6 i f = 1a ta = 25 b 1.6 2.1
mfn1106ms - tr 0 50 100 -10 0 -50 0 50 100 - 30 - 60 - 90 60 30 0 90 0.0 0.2 0.4 0.6 0.8 1.0 1.2 800 850 900 950 1,000 1,050 technical d ata spatial distribution conditions: ta = 25 , i f =1a relative radiant i ntensity vs. wavelength conditions: ta = 25 , i f =1a wavelength (nm ) page : 5 relative radiant intensity x and y direction : same shape 100 50 0 50 100 relative radiant intensity (%) x y 2017.4.25
mfn1106ms - tr -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 -40 -20 0 20 40 60 80 100 120 60 70 80 90 100 110 120 130 -40 -20 0 20 40 60 80 100 120 0.01 0.1 1 10 1 1.5 2 2.5 3 0.001 0.01 0.1 1 10 0.01 0.1 1 10 forward voltage vs. forward current condition : ta = 25 , tw = 100s forward voltage : v f (v) forward current : i f (a) forward current vs. relative total r adiant flux condition : ta = 25 , tw = 100s forward current : i f (a) junction temp . vs. relative total radiant flux condition : i f = 1 a junction temp. : tj ( ) relative total radiant flux junction temp. vs. forward voltage condition : i f = 1 a junction temp. : tj ( ) forward voltage : v f (v) technical d ata page : 6 relative total radiant flux : (%) 2017.4.25
mfn1106ms - tr 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 0.0001 0.001 0.01 duty=0.005 duty=0.01 duty=0.02 duty=0.05 duty=0.1 duty=0.2 duty=0.5 -30 -20 -10 0 10 20 30 40 -40 -20 0 20 40 60 80 100 120 junction temp. vs. peak wavelength fluctuation conditions : i f = 1a junction temp. : tj ( ) 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 maximum ratings of forward current soldering point temp. : ts ( ) maximum ratings of pulse forward current condition : ts = 85 pulse width : tw (s) peak wavelength fluctuation : p (nm) forward current : i f (ma) technical d ata pulse forward current : i frm (a) page : 7 2017.4.25
mfn1106ms - tr page : 8 soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. the leds constituent parts, including the resin, do not stabilize immediately after soldering. any mechanical stress may cause damage to the products. please avoid stacking the pcbs, or any other storage method which may cause the pcbs to bend; also, prevent contact of led with any materials . 3. the recommended temperature profile for reflow soldering is listed as the top surface temperature. this is due to the fact that temperature distribution varies on heating method, pcb material, other components in the assembly, and concentration of the parts mounted. typically, when fr - 4 pcb is mounted with one single led and heated via far infrared and hot air, the difference in temperature between pcb and led resin will be around 5 - 10 c. please do not repeat the heating process during reflow more than two times. note 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) 2017.4.25 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec max. pre - heating (soldering 230 max. peak temperature
mfn1106ms - tr soldering condition 4. when using a metal pcb, the solder may crack and problems may occur due to major stress on the soldered portion caused by thermal shock. please carry out a thorough advance verification before use. for the metal pcb's insulation, it is recommended to use stress - reducing materials 5. the products cannot be used for hand soldering and dipping (through the wave) soldering . 6. when cleaning, using isopropyl alcohol is recommended. some chemicals, including freon substitute detergent could corrode the surface of products, which cause discoloration, clouding, cracks and so on. please review the reference chart below when cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the led before using. cleaning with supersonic wave is not recommended . page : 9 cleaning agents recommended / not recommended isopropyl alcohol ? recommended ethyl alcohol ? recommended pure water ? recommended trichloroethylene x not r ecommended chlorothene x not r ecommended acetone x not r ecommended thinner x not r ecommended 2017.4.25
mfn1106ms - tr handling precaution page : 10 do not place electrified non - conductive materials near the led product. avoid led products from coming into contact with metallic materials.( should the metallic material be electrified , the sudden surge voltage will most likely damage the product .) avoid a working process which may cause the led product to rub against other materials . install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges . prepare a esd protective area by placing a conductive mattress (1m max.) and ionizer to remove any static electricity. operators should wear a protective wrist - strap. operators should wear conductive work - clothes and shoes. to handle the products directly, stanley recommends the use of ceramic, and not metallic, tweezers. 2. working environment dry environment is more likely to cause static electricity. although a dry environment is ideal for storage state of led products, stanley recommends an environment with approximately 50% humidity after the soldering process. recommended static electricity level in the working environment is 150v or less, which is the same value as integrated circuits (which are sensitive to static electricity). for electric static discharge ( esd ) 1. electrification/static electricity protection in order to avoid product (die) damage from static electricity caused by electrified operator and other materials electrified friction coming in contact with the product, stanley recommends taking the following precautions. 2017.4.25
mfn1106ms - tr handling p recaution other precautions page : 11 1. the products are designed to achieve higher performance reliability , however , they can be influenced by usage conditions. 2. absolute maximum r atings are set to prevent led products from failing due to excess stress (temperature , current, voltage, etc.). these ratings must never be overrun even for a moment. 3. to achieve the highest performance reliability, it is necessary to take into account, factors such as forward voltage adjusted to the usage temperature condition, derating of the power consumption, and other variable factors . 4. please insert straight protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current . 5. please avoid to using the products with materials and products that contain sulfur and chlorine elements because the reliability may be decreased. please keep in desiccator before and after mounting, to prevent the products from being affected by corrosive gas. also please make sure there isn't any gas in the surrounding area or entering from outside when using the products. 6. please avoid to stick foreign material because molding resin in the products has adhesiveness . and please don't touch lens portion. 7. supersonic wave welding is not recommended because wire open circuit may occur . ex) bonding outer lens to this product or housing 8. please check the actual performance in the assembly because the specification sheets are described for led device only . 9. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package ( junction part of die bonding and wire bonding). please make sure there is no problem before using. 10. the products are designed to perform without failure in the recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damage from these unexpected failures. 11. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff in advance when exceptional quality and reliability are required, when the failure or malfunction of the products might directly jeopardize life or health (such as for airplanes, aerospace, medical applications, nuclear reactor control systems and so on ). 2017.4.25
mfn1106ms - tr handling p recaution other precautions page : 12 12 . please avoid overload to the product when using tweezers to pick up leds. overload might cause deformation, disconnection, chip - outs and consequently lead to lighting failure . tweezers with flat tips is recommended, please avoid using tweezers with sharp tips . do not pick up by this area . (lens part) pick up point : substrate part. 13. low hardness resin is used for lens. please avoid overload to the surface of lens which might cause chip - outs, encapsulant delamination, and deformation, nicks, wire disconnection and decreasing reliability. be careful when dealing with the products and pay attention to following points . a) during mounting process, keep lens from coming in contact with absorbing nozzle and refer to precautions on next page. b) pay attention to handling and storage of leds even after mounting, because overload caused by stacking pcbs and shock due to dropping and crashing might also lead to deformation, disconnection, and chip - outs. c) in the processes of water pressure during cleaning, air pressure, drying and other processes after mounting, overload to lends should be avoided. 14. the formal specification sheets should be exchanged and signed by both parties. wire deforming caused by pressure test from upper side of lens 2017.4.25
mfn1106ms - tr handling p recaution handling precautions for product mounting page : 13 recommended conditions pick up point : substrate area of led ( area) (shown below) load : less than 5n reference to avoid the product breakage non allowed pick up area (lens portion) pick up area(substrate area) a convex shape lens. please adjust the load, the pick up point, the nozzle diameter and etc. before mounting because the over load can cause the breakage of the surrounding of led. recommendation of nozzle ? internal diameter of nozzle : 3.3 mm ? external diameter of nozzle : 3.7 mm ? pick - up position of nozzle : from the top of emboss tape ? if nozzle size is larger than opening part of emboss tape, pick - up should be done 0.1mm upper from emboss tape, or you can set holes (so that air can leak) on nozzle. 2017.4.25
mfn1106ms - tr packaging specifications time elapsed after package opening in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 60% page : 14 this product is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during shipping. however, in regards to storing the products, the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. this product is equivalent to ipc/jedec j - std - 020d msl 2a. (4 weeks) the package should not be opened until immediately prior to its use . if any components should remain after their use, please seal the package and store them under the conditions described in the above recommended storage condition . baking process should be performed after putting out from package. baking conditions: 10h(min.), at +60 5 just before use baking may be performed in the tape - reel form, however if it is performed with the reel stacked over one another, it may case deformation of the reels and taping materials, which may cause problems during production. please make sure that the product has cooled to normal temperature after performing the baking process. provided that, baking process shall be 2 times max. 2017.4.25
mfn1106ms - tr packaging s pecification moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting page : 15 2017.4.25 no. part name matelrial remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
mfn1106ms - tr packing b ox ( rohs ? elv compliant) the above measures are all the reference values. the box is selected out of the above table by shipping quantity. packaging s pecifications type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5af box type outline dimension l w h (mm) capacity of the box type a 280 265 45 (mm) 2 reels type b 310 235 265 (mm) 10 reels type c 440 310 265 (mm) 20 reels page : 16 2017.4.25 no. part name material remarks packing box corrugated cardbord without esd protection
mfn1106ms - tr label specification ( acc.to jis - x0503(code - 39 ) product label a. parts number b . bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e . bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g. bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number < remarks> bar - code font : acc.to code - 39(jix0503) packaging s pecifications b a page : 17 2017.4.25
mfn1106ms - tr cathode mark cathode side taping and r eel specifications (acc.to jis - c0806 - 03 appearance items specifications remarks leader area cover - tape cover - tape shall be longer than 300mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 13 pieces. (100mm) please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 20 pieces. (160mm) the end of taping shall be inserted into a slit of the hub. page : 18 note " - tr" means cathode side of leds should be placed on the sprocket - hole side. cover tape trailer area parts loaded area leader area 2017.4.25
mfn1106ms - tr taping and r eel specifications ( acc.to jis - c0806 - 03 qty . per reel mechanical strength others 500parts/reel minimum qty. per reel might be 100 parts when getting less than 500 parts. in such case , parts of 100 - unit - qty . shall be packed in a reel and the qty . shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.3n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. reversed - orientation, up - side down placing, side placing and out of spec. parts mixing shall not be held . empty pocket per reel is assumed until 1 piece. page : 19 2017.4.25
mfn1106ms - tr taping dimensions taping and r eel specifications ( acc.to jis - c0806 - 03 unit mm page : 20 reel dimensions a a cross section cathode side center hole 2017.4.25 carrier-tape with esd protection cover-tape with esd protection with esd protection carrier-reel no. part name remarks
mfn1106ms - tr lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 2017 7 , 2020 0 , 2021 1, ??? ) - 2digits production month (jan. to sep. , should be 01,02,03, ????? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits radiant intensity r ank . (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2digits chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) page : 21 2017.4.25
mfn1106ms - tr page : 22 correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 22 2017.4.25
mfn1106ms - tr reliability t esting result 1. reliability t esting r esult page : 23 2017.4.25 fig.1 thermal shock operating cycle 85 normal temp. - 40 15min. on 15min. off 1cycle 30 min. fig.2 temperature and humidity cycle test 80 25 - 30 1cycle 8h 90 % rh 1hr 1hr 1hr 1hr 1hr 1hr 1hr 1hr 0/18 0/18 0/18 0/18 0/18 0/18 0/18 failure 0/18 0/18 0/18 0/18 0/18 0/18 0/18 0/18 electric static discharge ta=-40 (15min) 125 (15min) m oisture soak:jedec level 2a preheating:150 180 120sec m ax. soldering:260 5sec ta=-40 (15min.) 85 (15min.), i f =1,000ma (fig. 1) ta=-30 80 , 90% rh, i f =1,000ma 5min./on 5min./off (fig. 2) 11 9 h 2 s 3ppm, ta=40 ,80% rh high temperature operating life test item pulse operating life temperature and humidity cycle thermal shock operateing cycle resistance to reflow soldering high temperature storage life low temperature storage life gas exposure test thermal shock 3 5 8 1,000h 1,000h 1,000h 1,000h 1,000h 1,000h low temperature intermission blinking operating life 4 6 7 12 13 30cycles 10 14 x,y,z 20h of each direction no. 1 2 15 vibration test 1,000h duration ta=85 , 85% rh, i f =1,000ma ts=85 , tw=100s, 1%duty, i f =5,000ma ta=85 , i f =1,000ma (5minon-5minoff) blinking 85times/min. ta=-40 , i f =1,000ma (5minon-5minoff) blinking 85times/min. ta=125 ta=-40 ta=-40 , i f =1,000ma tj=125 , i f =1,000ma test condition high temperature intermission blinking operating life high temperature humidity bias operating life low temperature operating life 3times of each polarity hbm(c=100pf, r2=1.5k, 8kv) 196m/s 2 , 50 500hz 1,000h 1,000cycles 2times 1,000cycles 96h
mfn1106ms - tr reliability t esting result page : 24 2. failure criteria 2017.4.25 v f appearance notable discoloration, deformation and crack acceptance criteria initial value 0.8 testing min. value & initial value 1.2 Q testing max. value initial value 0.9 measured value initial value 1.1 item symbol total radiant flux e forward voltage
mfn1106ms - tr 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application , medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 25 special notice to customers using the products and technical information shown in this data sheet 2017.4.25

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